墙面砖红外热成像无损检测及计算机模拟

INFRARED THERMAL IMAGING NONDESTRUCTIVE TESTING AND COMPUTER SIMULATION OF WALL TILE

应用红外热成像测温技术进行材料或器件的无损检测，其基本原理是测量材料表面的温差，缺陷在表面所形成的温差越大，则红外热成像所测得的热图像越清晰。本工作应用计算机技术，采用有限元分析方法，用墙面砖作为研究对像，对坯体表面温差形成的机理，表面温差与坯体内部的性质，如缺陷的深度、热激发温度、材料的导热系数等的关系进行计算机模拟研究，并用ＨＲ－２红外热成像仪实测校验，为探讨最佳的红外热成像无损检测条件提供一定的理论根据。

The infrared thermal imaging nondestructive test(INDT )with infrared thermal imaging appara-tus(ITA)is used to measure the surface temperature. The more the difference of temperature on the surface,themore clear of thermal image obtaind.With the help of computer technique and FEM ,the mechanism of surfacetemperature difference induced by flaws in wall tile and the relationship between the surface temperature differ-ence and the internal characteristics of ceramics itself(e.g. depth of flaws from the surface,heat pulse tempera-ture and the thermal conductivity coefficient of materials etc.)are studied using computer simulation and ITA.