烧成温度对C－B＿4C－SiC复合材料结构与性能的影响

The Influence of Sintering Temperature onMicrostructure and Properties of C-B_4-SiC Composite

本文就烧成温度对Ｃ－Ｂ＿４Ｃ－ＳｉＣ碳／陶复合材料结构与性能的影响进行了初步研究，发现复合材料密度、强度随烧结温度的升高而明显提高，电阻率随烧成温度的升高而下降，这和烧成体显微结构（气孔率、晶粒大小与分布、晶界状况等）密切相关。

The influnce of sintering temperature on the microstructure and proper-ties of C-B_4 C-SiC composite was preliminary studied.The density and strength of thecomposite increase markedly with the increaing of the sintering temperature, but thespecitic resistance decreases. The properties of the composite are closely related to itsmicrostructure such as the density of the gas hole,the grain size and distribution,thestate of the grain boundary.