碳化硅微粒与铜复合电沉积过程模型试验

MODEL OF COMPOSITE ELECTRODEPOSITION PROCESS OF SILICON CARBIDE PARTICLES WITH COPPER

应用相似理论于复合电沉积研究中,同时考虑电化学因素和流体力学因素对复合电沉积过程的影响,建立了固体微粒与金属复合电沉积过程的模型。对碳化硅微粒与铜在酸性硫酸铜溶液中的复合电沉积过程,通过实验求出了关联式的有关参数。用导出的关联式关联碳化硅微粒的共沉积量,计算值与实验值吻合较好,误差最大不超过6%。

Similitude theory is used in the research of composite electrodeposition in this paper for the first time. Considering simultaneously the effect of factors of hydrodynamics and electrochemistry,a model describing composite electrodeposition process of solid particle with metal is established. For the composite electrodeposition process of SiC particles with Cu in acidic copper sulfate solution, values of parameters in the correlation equation established are obtained through experiment. Prediction of the codeposition amount of SiC particle in Cu -SiC composite coating is made by using the correlation equation. It is found from the results that the prediction value is close to the experimental value with deviation not larger than 6%.