微力电系统中多层膜的端部应力集中

EDGE EFFECT STRESSES IN MULTILAYER FILM WITHIN MICROMECHANICAL-ELECTRONIC SYSTEM

微电子技术的发展对其本身及封装的结构可靠性提出了更高的要求，微机械的出现又使得微电子机械元器件的电学行为和力学行为密不可分，从而扩展成为一个统一的微力电系统。微力电系统的强度问题主要是多层膜在制造和使用过程中，由于不同材料热学与力学参量的失配引起的残余热应力，特别是在界面和端部的应力集中。本文应用有限元方法分析了在不同的端部几何形状和组合形状下，多层膜中应力沿界面的分布。对于微电子元件在成型过程中产生的残余应力，则同时讨论了温度历史和结构几何形状变化引起的应力重分布。对计算结果的分析和比较，可以帮助我们加深对结构和工艺优化问题的深入理解。

The development of mieroelectronics requires higher reliability for its structure and packaging, and the new comer micro-mechaism identify the electronic performances with mechanical ones of a component, so as to extend it into a united micro mechanical -electronic system. In this system, the strength problem is the residual thermal stress caused by the mismatch of thermal and mechanical parameters while manufacturing or working specially stress concentration at the interface and the edge.In the precent paper.the stress-distribution along the interfaces in the multilayer thin films with complex edge geometric configuration and edge combined configuration dre analysed by using finite element method. The residual stress distributions of a typical microelectronic component during manufacturing process and their evolution are also discussed, we attempt to simulate the stress rearrangement induced by thermal history and configuration changingThe comparision of stress distributions at the interface of different edge geometry provides a deeper understanding on how to optimize the structure and manufacturing for electronic components.