摘要
研究了一种新的印制板用电解铜箔后处理工艺,依次进行电镀Zn-Ni基三元合金、铬酸盐钝化、浸有机膜等。给出了电镀Zn-Ni基三元合金和铬酸盐钝化的工艺参数,并对各影响因素进行了分析。对经过上述工艺处理的电解铜箔进行了性能测试,结果表明,经过该工艺处理的电解铜箔的耐蚀性、耐热性和与印制板基体的结合强度等均有明显提高,铜箔的抗剥强度为2.15,劣化率为1.38%。
A new post-treatment technics on electrolytic copper foil used for printed board was studied, including electroplating Zn-Ni based ternary alloy, chromate passivation, dipping for organic film. The technological parameters of electroplating ternary alloy and chromate passivation were given and the factors influencing the parameters were analysed. The performance of copper foil obtained with above technology was tested. The results prove that the corrosion resistance, thermostability and adhesion between copper foil obtained with above technology and substrate are improved obviously, and the peeling resistant strength of copper foil is 2.15, with a deterioration percentage of 1.38%.
出处
《电镀与涂饰》
CAS
CSCD
2005年第8期42-45,共4页
Electroplating & Finishing
