摘要
高功率、高密度、小型化是现代电子封装结构的基本特征,软焊料是电子封装中应用最广的连接材料,一个焊点的破坏往往导致整个封装结构的失效。软钎料的无铅化是目前发展的重要趋势。针对目前所开发的无铅焊料,文中介绍电子封装结构中焊点的破坏行为和焊点寿命预测的基本方法。
High power, high density and miniaturization are the basic characteristics of modem electronic packages. Solders, as the important materials for mierojoining and interconneefion, play a fundamental role in the assembly of the devices. However, the failure of one soldered joint is frequently found to be the origin of the failure of the whole package. The phase out of lead is the major target of next generation solders. Based on the review of the developed Pb-free solders and their applications, the failure behavior and the life prediction methodologies for Pb-free solder joints were presented and discussed.
出处
《机械强度》
EI
CAS
CSCD
北大核心
2005年第4期470-479,共10页
Journal of Mechanical Strength
基金
国家自然科学基金(No.50475043)
北京市自然科学基金(2052006)
教育部博士点基金(No.20040005012)的资助~~
关键词
电子封装
无铅焊料
寿命预测
Electronic package
Pry-free solders
Life prediction
