溶液混合与界面渗透法制备聚噻吩衍生物聚酰亚胺导电复合材料的研究

Study on the Polythiophene Derivative /Polyimide Conductive Composite Prepared by Solution Blending and Contact Permeation Methods

本文介绍了高分子溶液混合与界面渗透法制备导电高分子复合材料的方法并对复合材料的结构和性能进行了表征。十二烷基取代聚噻吩四氢呋喃溶液与聚酰亚胺酸N-甲基吡咯烷酮在一定时间界面的互相渗透,十二烷基取代聚噻吩可嵌入聚酰亚胺酸层中。在溶剂挥发后,用化学或加热的方法进行酰胺化而得到稳定的导电高分子复合膜。表面电阻率、热失重及扫描电镜分析表明,与溶液混合法相比,界面渗透法制备的复合材料具有良好导电性能和稳定性。

Conductive composite films by solution blending and contact permeation of the conducting guest species into the polyimide （PI） host were prepared, and their structure and properties were discussed in this study， A layer of poly （3-dodecyl thiophene） （p3ddt） was embedded at the surface of polyimide by permeation of t poly （3-dodecyl thiophene） （in tetrahydrofuran （THF）） into a solution of polyamic acid in n-methyl pyrrolidinone （NMP）. After solvent evoparation, the resulting composites could be imidised thermally or chemically. As observed from the surface resistivity, thermogravimetry analysis （TGA） and scanning electron microscopy （SEM）, compared to the composite from solution blending, the conducting composite from permeation exhibited higher conductivity and stability even after solvent extraction。