摘要
本文研究了Sn-Sb-Cu(Bi)系无铅钎料的润湿性、显微组织以及熔化特性,对Sb、Cu、Bi等元素在Sn基钎料中的作用进行了阐述,发现了几种有应用潜力的合金,有望取代现有广泛使用的SnAg(Cu)系钎料。
The flowability ＆ wettabi[ity and the micro-tissue together with the melty property of Sn-Sb-Cu-（Bi） based solders alloys were studied in this paper, the influence of the additives such as Sb. Cu and Bi was also tested. As a result, some alloys were found to have excellent property and supposed to replace the SnAg（Cu）based solders which have a popular application nowadays.
出处
《电子质量》
2005年第8期55-58,共4页
Electronics Quality
