摘要
本文所研究设计的基于单片机系统的石英晶片厚度检测仪是为生产中测量晶片厚度而设计的,它利用LVDT传感器检测晶片厚度信息,在单片机系统中进行数据处理,利用传感器感应电势与晶片厚度成线性的关系,将厚度信息进行转换显示。其具有结构简单、操作方便、性能稳定可靠、精确度高等特点,可广泛使用于超薄物件的精确测量,具有很好的应用前景。
Based on single chip microcomputer (SCM) system, the quartz wafer thickness gauge is designed for measuring wafer thickness in production. Wafer thickness information is detected by LVDT. Data are processed with SCM system, and then thickness information can be showed according to linear relation of sensor electric potential and wafer thickness. It has easy structure, convenient operating, steady performance and high precision, so it can be widely used for precise measurement of ultra thin things and has good prospect.
出处
《机电工程技术》
2005年第8期38-40,共3页
Mechanical & Electrical Engineering Technology
