酸性化学镀Ni-W-P合金镀层工艺研究

The Technics Research of Acidity Chemical Plating Ni-W-P Alloy Plating Layer

酸性化学镀M-W-P合金的可能性判定,探索次亚磷酸钠在酸性介质中将WO42-还原成W的机理,寻找在施镀条件下使W-O键松驰、断裂的催化剂,实现化学镀Ni-W-P合金镀层的生产应用。

The possibility determinant of acidity chemical plating Ni - W - P alloy, explore sodium hypophosphite making WO4^2- revert to W mechanism in acid medium, look for the activator making W - 0 key loosen, rupture under applying plating condition, carry, out the production appliment of chemical plating Ni - W - P alloy plating layer.