摘要
利用包含非奇异项的裂纹尖端弹性场解，给出了一个用于Ⅰ型裂纹问题的光弹性分析方法；与现有的方法相比，本文的方法精度更高，而取数区反而扩大了．
A photoelastic analysing procedure for mode- l crack problems was presented by employing the crack tipstress field expression including nonsingular terms. Compared with other procedures available,the presentprocedure had a much higher accuracy with a relatively larger data zone.
出处
《科技通报》
1995年第3期142-146,共5页
Bulletin of Science and Technology
关键词
Ⅰ型裂纹
光弹性
应力强度因子
裂尖
裂纹
mode-Ⅰ crack:photoelasticity
stress intensity factor(SIF):crack tip:nonsingular term
