IC封装的模型及参数测量

IC PACKAGE MODEL AND PARAMETER MEASUREMENT

本文提出描述ＩＣ封装电特性的物理模型及用时域反射测量其模型参数的方法，并采用了Ｚ—Ｐｒｏｆｉｌｅ算法，大大提高了测量精度。

This paper introduces a physical model of describing characteristics of IC packages and its parameter measurement based on TDR. The measuremtent accuracy is improved significantly by using the Z-Plofile algorithm.