温度参数法用于薄板的安定优化设计

Shakedown Optimum Design of Plates by Temperature Parameter Method

通过对薄板的Ｂ样条函数插值及结构中残余应力场的温度参数模拟，研究了薄板安定分析的样条有限元列式，在分析结构安定分析的数学规划列式的基础上，解决了薄板结构在给定可变载荷作用下的安定最小厚度设计问题。由于温度参数的引用，使得研究的问题的自由度大幅度减少。算例表明本文所提出的方法及所编程序的可行和有效。

B spline function is used to interpolate plate structures, and the self-equilibrated residual generalized stress fields are simulated by the temperature parameters.The spline FEM formulation of thin plate's shakedown is studied, and the problem of the optimum shakedown design of plates under the given variable loading is solved on the basis of analysis of shakedown formulation of mathematical program. The degress of freedom of the problem studied are much decreased for the use of temperature constants.The program coded and computing examples show the correctness and effectiveness of the proposed method.