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集成电路引线框架材料成品退火工艺探讨 被引量:3

Making an Approach to Annealing Technology of Finished Products of IC-Lead Frame Materials
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摘要 用于集成电路引线框架的Fe-42%Ni合金带不仅要求其物理、机械性能达到一定指标,还要求板形好,使之能适应冲压、腐刻、电镀、钎焊、封装等工序的考验。根据上述要求,在对Fe-42%Ni合金带的成品退火工艺进行了研究、探讨,并利用X射线衍射等实验手段及金属学理论进行分析后得出,温度低于该合金再结晶温度并控制保温时间的张力退火,能使Fe-42%Ni合金带的各项性能得到大幅度改善,满足集成电路引线框架的使用要求。 Fe -42%MI Alloy strip used as IC-lead frame must meet not only requirement of physical and meehanical properties to reach for certain index, but also one of good plate shape in order to adapt to test ot pressing、etch-ing,electroplating,solcicring and packaging procedures. According to above-mentioned requirements,after studing and approaching annealing technology of Fe-42%ni alloy strip by using X-ray diffraction method and metallography theory,we find out various properties of Fe-42%Ni alloy strip have improved significantly by means of tension annealing which is conducted below recrystallization annealing temperature and control of holding time of tension annealing,as to meet requirements for application of IC-lead frame.
作者 林冀 王孝培
出处 《上海钢研》 1995年第6期28-32,共5页 Journal of Shanghai Iron and Steel Research
关键词 集成电路 引线框架 再结晶 铁镍合金 退火 IC-lead frame matcrials rccrystallization temperature tension annealing
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