摘要
研究了155Mb/sLD光发射马区动器.光接收前置放大器、光接收前放+主放等长波长光电子集成组件,适合当前SDH光纤通信技术发展的需要.对上述3种155Mb/s光电子集成组件的电路结构、PIN/FET前放的PSPICE计算机模拟结果及测试方法与测试结果,和研制组件所采用的光电子厚膜混合集成与微构装技术作了介绍.
The long wavelength optoelctronic integrated modules of 155Mb/s LD optical transmitter driver, optical receiver preamplifier and optical receiver preamplifier+post amplifier are studied in this paper. They are suitable for the development of SDH optical fiber communication technology. Also introduced in this paper are the circuit structures of the above mentioned three 155Mb/s optoelectronic integrated modules, the results of PSPICE simulation of PIN/FET preamplifier, testing method and results and optoelectronic thickfilm hybrid integrated technology.
出处
《上海交通大学学报》
EI
CAS
CSCD
北大核心
1995年第6期42-48,共7页
Journal of Shanghai Jiaotong University
关键词
光电子集成
组件
厚膜混合集成
微构装技术
optoelectronic integration, modules, thick-film hybrid integration, micro-packaging