化学热处理钎焊机理的研究

Study on the Soldering Mechanism of Chemical Heat-treatment Soldering

介绍了一种新的钎焊技术，即化学热处理钎焊法，并对钎焊机理进行了探讨。试验结果表明：化学热处理钎焊法具有操作简单、适用性强、自钎功能好。

In this paper,a new kind of soldering technique,namely,chemical Heat-treatment sol-dering process (CHSP) is introduced.The main research deals with studying soldering mech-anism on the basis of many experiments and the experiment results show that CHSP possessessuch characteristics as process simplicity extension suitabilioy,low costs efficient solderabilityand higher strength of soldered joints.