摘要
用PECVD方法制备出高电导率(~0.2scm-1)、宽带隙(~2.2eV)的P型微晶化硅碳合金(p-μc-SiC:H)薄膜材料。利用p-μC-SiC:H/p-a-Si:H复合结构做a-Si太阳电池的窗口材料,明显改善了SnO2/p之间的接触特性,从而使10cm×10cm单结集成型电池的填充因子从0.70以下提高到0.72。
High conductivity (~0.2scm-1) and wide band gap (~2.2eV) p-type microcrystalized silicon-carbide alloy (p-μ c-SiC:H) thin films were fabricated by PECVD method. The p-μc-SiC:H/p-a-SiC: H structure as window layer of solar cells improved obviously the contact characteristics of SnO2/P. Purthermore. the fill factor of single junction integrated solar cells with area of 10cm×10cm increased from below 0.70to 0.72.
出处
《太阳能学报》
EI
CAS
CSCD
北大核心
1995年第3期263-267,共5页
Acta Energiae Solaris Sinica