陶瓷－聚丙烯复合薄膜的介电性能

THE DIELECTRIC CHARACTERISTICS OF CERAMICSPOLYPROPYLENE COMPOSITE FILM

研究了陶瓷介电常数、陶瓷加入量和陶瓷－聚丙稀复合薄膜介电性能间的关系，给出适合本陶瓷－聚丙烯复合系统的介电常数公式．提出的陶瓷颗粒包覆方法可有效提高复合膜的力学性能，使陶瓷粉加入量由４０％提高到５６％（ｖｏｌ％）．陶瓷颗粒包覆后，采用轧膜工艺制备出厚度为１００μｍ、力学性能优良、介电常数大于２０、介电损耗小于５０×１０－４、容量变化率小于４％的复合膜．还对包覆和未包覆陶瓷－聚丙烯复合膜的显微结构进行了研究．

his paper studies the relation between the dielectric constant of ceramics and the quantity of ceramics powders to be add.ed, and the dielectric constant of the ceramics polypropylene composite film. This paper also Proposes a method of coating ceramic powder.The ceramic polypropylene composite film with a thickness of 100μm was made of polypropylene and coated ceramics powders. It has good mechanical properties, with a dielectric constant more than 20, a dielectric loss less than 50×10-4 and a ratio of capacitive variability less than 4%.The microstructurs of both coated and uncoated ceramic polypropylene composite film are studied too.