2Y.Yoneda,T.Horiuchi.Optical flats for use in X-ray Spectrochemical Microanalysis[J].Rev.Sci.Instrum,1971,42:1069-1070.
3P.Pianetta,K.Baur and S.Brennan,Application of synchrotron radiation to TXRF analysis of metal contamination on silicon wafer surfaces[J].Superficies yVacio,1999,9:17-21.
4Meredith Beebe,Scott Guisinger,Syotaro Kawai,A New Application of Vapor Phase Decomposition for Thermal Oxides,Technos公司资料.
5Improving Tool Design and Performance with Precision Wafer Surface Scan[EB/OL].http://www.balazs.com/file/otherelement/pj/app0456%20automated%20vpd%20icp-ms%20for%20tools61601.pdf.
6John J Rosato,M.Rao Yalamanchili,Evanson G.Baiya,et.al.Implementing a fully integrated IPA drying processin the fab environment[J].Micromagzine,2003:1-6.
