柯伐镀金盖板电化学腐蚀的剖析及其防腐措施

CoupleCorrosion of Gold- plated Covar Lids and Its Prevention

对半导体器件封装的气密性失效进行了研究。发现，柯伐镀金盖板遭致电化学腐蚀是导致气密性失效的主要原因。对电解液的形成和电化学腐蚀机理进行了深入的分析。提出了防止腐蚀，提高器件气密可靠性的思路和方法。

Hermetic failure of IC packages is investigated.It is found that couple corrosion of the package lid is responsible for the failure. The formation of electrolyte and mechanism of couple corosion are analyzed. Ideas and methods to prevent such corrosion are proposed.