摘要
用三维光弹性应力分析方法,对Thompson半精密附着体固位与RPI卡环固位下颌双侧游离端可摘局部义齿在牙槽骨内的应力分布进行了研究。同时,比较了两种不同固位方法的牙槽骨内的应力分布规律。获得了基牙根尖应力。
This paper applied 3-D photoelastic stress analysis method,studied the stress distribution on bone of mandibular bilateral-distal-extension removalbe partial dentures which retained by Thompson Dowel Semi precision attachment and RPI Assembly. Nearwhile,the stress distribution on bone by two diffrent types retention was compared. The stress of abutment apical was obtained.
关键词
可摘局部性
义齿
固位体
牙槽骨
应力
牙体修复
D photoeiastic
denture removable partial
thompson dowel semiprecision attachmentRPI assembly