再流焊工艺中表面组装片式元件热应力模拟

Modeling of thermal stress in the surface mounting of chip compenents during solder reflow process

文中根据无耦合拟静态热弹性力学理论，采用有限元分析技术，结合ＳＭＴ再流焊工艺，分析了典型表面组装结构的热传输特性与热应力。以清晰、直观的等值线图描绘了再流焊各阶段温度的分布及应力场分布，使人们可定量地了解表面组装件在焊接过程中的热传输特性及热应力分布。该方法可用于ＳＭＴ再流焊工艺（温度曲线）的优化和温度曲线的计算机辅助设计，有助于提高ＳＭＴ的成品率与产品的可靠性。

According to the theory of uncoupled,quasi-static thermoelastic mechanics,heat transfercharicteristic and thermal stress of the typical surface mounting structure during solder reflow process is analised with the finite element technique,resulting in clcar and audio-visual contourmap describing the dist ributing of the tem perature field and the stress field.The method is a powerful tool which can be used to optimize process of SMT solder and computer aided designof temperature curve,It is conduced to improve rate of SMT end products and reliable.