Si面键合技术及其应用

Progress and Application of Silicon Wafer Bonding Technology

回顾了Ｓｉ面键合技术的历史，研究了国外此工艺技术发展过程与趋势，分析了Ｓｉ面直接键合技术的特点和它在压电与声光器件中的应用。

A review of silicon wafer bonding technology,in terms of their past,present and fu- ture developments,especially in foreign countries,is made in the paper.The characteristics of sili- con wafer direct bonding technology as well as its applications in piezoelectric and acoustooptic de- vices are discussed.