半导体器件纵向结构模拟工具

Simulation Technique of Vertical Structure of Semiconductor device

介绍了半导体器件纵向结构准三维模拟方法，包括版图信息提取，二维工艺模拟等功能。该模拟器可以根据版图信息和工艺参数自动显示器件上任意切线位置处断面图，稍加修改即可用于对Ｓｉ压力传感器等部分压电器件进行工艺模拟。

A quasi-three-dimension simulation approach Of semiconductor device vertical structure is described,including extraction of parameters from layout,two-dimension simulation of processing,storage of cross-section data and program fuction.This simulation can automatically display the cross sectional view of device chip along an arbitrary cut-line according to the input lay-out and processing information.