摘要
本文介绍在IBM系列及其兼容系列微型机上,实现硅压力传感器中硅杯结构的应力分析方法和软件.该软件对微机软、硬件资源的要求很低,能对包括工艺误差在内的各种复杂的硅杯结构绘出准确的应力分析图.
This paper introduces a new method and a software for stress analysis of silicon pressure sensors. The software that is suitable for IBM series and their compatible computershas low requirement of software and hardware resources, but can produce accurately stress graph for various complicat-ed structures of silicon pressure sensors, even taking consideration of process errors.
出处
《仪表技术与传感器》
CSCD
北大核心
1995年第5期8-10,16,共4页
Instrument Technique and Sensor
关键词
硅压力传感器
CAD
微机
传感器
Silicon Pressure Sensor, Stress Analysis,Micro-Computer.
