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镍阳极氧化膜形成和破坏过程的光电化学响应 被引量:3

PHOTOELECTROCHEMICAL RESPONSE OF ANODIC FILM ON NICKEL DURING ITS FORMATION,GROWTH AND BREAKDOWN PROCESSES
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摘要 测定了镍表面阳极氧化膜在pH=8.4硼砂-硼酸缓冲溶液中不同电位下的光电流响应。基于阻抗测量结果的计算表明,钝化膜的平带电位和载流子密度分别为-0.68V和1.3×10(20)cm(-3)。对钝化膜和高价氧化膜在形成、生长和破坏过程中的光电流变化进行了现场监测。 The photoelectrochemical response of anodic oxide flm on nickel in pH 8.4 borax-borate buffer solution has been investigated. Experimental results show that both passive film and high valence oxide film are n-type semiconductors.The passive film is formed by direct oxidation of nickel on the surface.Its flat band potential and carrier density are -0.68V and 1.3x1020cm-3 respectively.For the high Valence oxide film, a dissolution-deposition process is proposed.During the formation, growth and breakdown of the anodic film, the corresponding changes in photocurrent are monitored. At the initial stage Cl-penetrates into the film, which results in a sudden change in its electronic character and then photocurrent increases remarkably.
出处 《中国腐蚀与防护学报》 CAS CSCD 1995年第3期217-222,共6页 Journal of Chinese Society For Corrosion and Protection
关键词 阳极氧化膜 半导体 光电流 Nickel Anodic film Semiconductor Photocurrent
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