摘要
通过透射电子显微技术研究了25、100和200mg/kgCu对小麦幼苗根尖和叶片细胞超微结构的损伤。结果表明:25、100和200mg/kgCu均对小麦幼苗细胞造成明显损伤。Cu胁迫导致根尖和叶片细胞产生质壁分离,细胞质浓缩;叶绿体膨胀,片层结构紊乱,被膜消失,解体;线粒体结构模糊,空泡化等。Cu胁迫浓度与对小麦细胞超微结构的损伤程度呈一定的正相关性,且Cu对细胞各部位或各细胞器的损害程度不同,其中线粒体对Cu反应最为敏感,而不同部位的细胞器对Cu的耐性反应也存在一定差异。
Transmission Electron Microscope (TEM) Technology was used to investigate the effect of 25,100 and 200 mg/kg copper on ultra-structure of root tip and leaf blade of wheat. Result showed that serious damage was found with Copper of 25,100 and 200 mg/kg. Plasmolysis,concentrated cytoplasm,chloroplast inflation,lamellar structure disturbance,capsule disappearance and disintegration,mitochondria structures ambiguity and vacuolization were all symptoms under Cu stress. There were positive correlation between concentration of coper stress and the degree of injury,and the degree of injury of copper were different in different organelles. Mitochondria were the most sensitive organelles,and there was patient difference in the same organelles of different parts.
基金
Supported by Scientific and Technological Fund from China University of Mining and Technology (D200402)~~
