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硅材多线切割应力场的计算机仿真分析

Computer simulation analysis of the stress field of the silicon multi-wire-saw
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摘要 首先对硅材多线切割过程中应力场进行了理论分析,得出切割力的理论计算公式。基于有限元仿真技术,通过ANSYS软件对硅材多线切割加工区的应力分布和应变进行了仿真,分析了硅材进给速度和钢丝线切割速度对硅材应力分布和应变的影响。 First the theory of the cutting force during the multi-wire-saw was analyzed,so the academic calculation formula of the cutting force was known.Based on the finite element simulation technique,the stress distributing and the strain of the cutting district of the silicon multi-wire-saw were simulated and analyzed,so: when the feed speed does not change,as the linear velocity of cutting decrease,the silicon strain and the stress get bigger and bigger;when the linear velocity of cutting does not change,as the feed speed adds,the silicon strain and the stress get bigger and bigger.
作者 蒋瑜 马春翔
出处 《机械设计与制造》 北大核心 2010年第12期95-97,共3页 Machinery Design & Manufacture
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