电镀阴极移动装置设计

Design of cathode mobile device for electroplating

传统的电镀工艺一般采用静止挂镀的方式。随着产品要求的提高,传统的静挂方式已经无法满足产品技术要求。针对这一问题,设计出电镀阴极移动装置,使产品镀银层密度均匀。

Traditional electroplating process generally selects the method of static hang plating.With the improvement of product requirements,the traditional way of static hang has been unable to meet the technical requirements for products.In view of this question,the cathode mobile device for electroplating was designed,so the silvered film density of products became even.