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浙江某500 kV变电站线夹开裂原因分析 被引量:4

Analysis on Causes for Crack of Clamps in 500 kV Substation
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摘要 浙江某500kV变电站的线夹出现突鼓或开裂,其主要原因是铸造质量不良,间接原因是施工工艺不规范,加上低温多雨天气的影响。应提高线夹的制造工艺水平,可采用铝液态模锻新工艺;严格执行现行《架空电力线路液压接续施工工艺规程》所明确的压接程序:液压方向为自管底向管口连续施压。
出处 《电力建设》 2005年第8期30-31,40,共3页 Electric Power Construction
关键词 变电站 线夹 开裂原因 预防措施 substation terminal clamp causes for crack preventive measures
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同被引文献34

  • 1Young Min Kim,Hee-Ra Roh,Sungtae Kim,Young-Ho Kim.Kinetics of Intermetallic Compound Formation at the Interface Between Sn-3.0Ag-0.5Cu Solder and Cu-Zn Alloy Substrates[J].Journal of Electronic Materials.2010(12)
  • 2Chi-Yang Yu,Kai-Jheng Wang,Jenq-Gong Duh.Interfacial Reaction of Sn and Cu-xZn Substrates After Reflow and Thermal Aging[J].Journal of Electronic Materials.2010(2)
  • 3Wenming Tang,Anqiang He,Qi Liu,Douglas G. Ivey.Room temperature interfacial reactions in electrodeposited Au/Sn couples[J].Acta Materialia.2008(19)
  • 4Jiahu Ouyang,Eswar Yarrapareddy,Radovan Kovacevic.Microstructural evolution in the friction stir welded 6061 aluminum alloy (T6-temper condition) to copper[J].Journal of Materials Processing Tech.2005(1)
  • 5Tao-Chih Chang,Moo-Chin Wang,Min-Hsiung Hon.Growth and morphology of the intermetallic compounds formed at the Sn–9Zn–2.5Ag/Cu interface[J].Journal of Alloys and Compounds.2005(1)
  • 6Jeong-Won Yoon,Young-Ho Lee,Dae-Gon Kim,Han-Byul Kang,Su-Jeong Suh,Cheol-Woong Yang,Chang-Bae Lee,Jong-Man Jung,Choong-Sik Yoo,Seung-Boo Jung.Intermetallic compound layer growth at the interface between Sn–Cu–Ni solder and Cu substrate[J].Journal of Alloys and Compounds.2004(1)
  • 7Won-Bae Lee,Kuek-Saeng Bang,Seung-Boo Jung.Effects of intermetallic compound on the electrical and mechanical properties of friction welded Cu/Al bimetallic joints during annealing[J].Journal of Alloys and Compounds.2004(1)
  • 8Kyung-Seob Kim,Chung-Hee Yu,Jun-Mo Yang.Aging treatment characteristics of solder bump joint for high reliability optical module[J].Thin Solid Films.2004
  • 9Yutaka Fujiwara.Sn deposition onto Cu and alloy layer growth by a contact immersion process[J].Thin Solid Films.2002(1)
  • 10汤文明,D. G. IVEY.Solid state interfacial reactions in electrodeposited Cu/Sn couples[J].中国有色金属学会会刊:英文版,2010,20(1):90-96. 被引量:8

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