摘要
在有规律地改变键合温度的条件下,分析不同温度对热超声键合工艺连接强度的影响规律,并研究温度因素对整个系统的PZT换能器输入功率及阻抗的影响.试验研究发现,温度过低(低于601℃)导致键合不成功或连接强度很低,温度过高(高于300℃)导致连接强度降低,最佳的键合窗口出现在200～240℃区间,此时连接强度达20g左右.对推荐使用的大于5.4 g的连接强度标准,文中试验条件下可键合窗口为120～360℃.而且,对于恒定额定功率设置的PZT换能器系统,温度的改变导致PZT换能器实际加载的功率及阻抗的改变.这些试验现象和分析结果可作为整个键合系统工艺参数匹配及优化的依据.
This investigation is to determine the effect of temperature on bonding strength, impedance and power of PZT transducer in thermosonic bonding process. The results show that, too low less than 60°C or too high more than 300°C temperature can lead to unsuccessful bonding or low bonding strength. A suitable temperature window is 200°C to 240°C, which can lead to about 20 g bonding strength. As for the recommended production specification average value 5.4 g for 25 um diameter wire used, the available bonding window is 120°C to 360°C. Moreover, for the fixed power setting of PZT transducer, the temperature change can lead to difference in actual power and impedance of PZT transducer. These experiment phenomena and analyses can be used for bonding parameters match and optimization in thermosonic bonding.
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2005年第8期23-26,38,共5页
Transactions of The China Welding Institution
基金
国家自然科学基金资助项目(50390064)
国家重点基础研究规划973项目(2003CB716202)
中南大学研究生教育创新工程(030617)
