摘要
针对钎料与焊盘间形成IMC层的厚度是影响可靠性的一个关键因素.对无铅钎料Sn-3.8Ag-0.5Cu与Cu盘进行了重熔,采用O lympus(光学金相显微镜),SEM(扫描电镜)和EDX(能谱X射线)界面分析手段,研究了合金Sn-3.8Ag-0.5Cu与Cu焊盘接头的钎焊性和在焊接过程中IMC的形成与长大机理,探讨了IMC厚度与保温时间的变化规律.研究结果表明,无铅钎料合金Sn-3.8Ag-0.5Cu在钎焊条件下与Cu焊盘能够实现良好的连接,其连接层为Cu6Sn5金属间化合物,重熔时的IMC层生长基本上符合抛物线规律.
Aiming at the IMC（ intermetallic compound） thickness between solder ang pad is a major concern to reliability, Sn-3.8Ag-0. 5Cu and Cu pad are reflowed, solderability of the lead- free solder/Cu pad,formation and growth mechanism of IMC layer are studied in the solding by means of Olympus, SEM and EDX analysis methods. The results indicated that smooth surface solder bump can be found and the Cu6Sn5 intermetallic compound is formed. The thickness of IMC growth is in accord with the rule of parabola.
出处
《哈尔滨理工大学学报》
CAS
2005年第4期16-18,共3页
Journal of Harbin University of Science and Technology
基金
2004年度现代焊接生产技术国家重点实验室基金资助
关键词
金属间化合物
无铅钎料
界面反应
intermetallic compound
lead-free solder
mtertacial reaction
