摘要
烽火通信科技股份摘要简要介绍了多芯片组件(MCM)技术的概念、分类、发展现状、应用情况等。MCM是现代组装技术的新概念,它的出现促进了SMT(表面贴装技术)与SMD(表面贴装元器件)的发展和革新,并将成为高密度、高性能、多功能封装的最佳选择。
This paper simply introduces the things of the MCM＇s concept, division, development and application. MCM is a new concept of contemporary assembly technology. MCM has developed and innovated the SMT/SMD since it was appeared. It is believed that MCM will be the best choice of the IC with density, high performance and multiple function.
出处
《信息技术与标准化》
2005年第9期14-17,共4页
Information Technology & Standardization
