电沉积钨钴合金的工艺研究

Study on the Process of Tungsten-cobalt Alloy Electrodeposition

研究了W-Co合金电镀工艺,讨论了电流密度、主盐浓度、阳极、pH值和温度对电镀的影响,并对在不同基体材料上的电镀钨合金的难易程度进行了比较。结果表明,电流密度在4～6A/dm2,镀液的pH=4～5.5,室温下就能获得较好的合金镀层。在不同基体金属上电镀W-Co合金时,基体金属的电位要正于镀层金属的电位,才能获得结合力良好的镀层。

Tungsten-cobalt alloy electroplating process is studied. The influences of current density, main salts, anode, pH value, temperature on electroplating are investigated, and compared with electroplating on the different matrix. The results show that the better properties of deposits can be attained in the room temperature when the current density is 4～6A/dm2 and pH is 4～5.5, and the good adhesion to the matrix can be also acquired on condition which the matrix potential is positive to the counterpart of plating.