摘要
焊膏印刷是SMT生产中关键工序之一，其控制直接影响着组装板的质量。本文介绍了焊膏印刷中影响质量的诸多因素并分析其原因，同时提出部分纠正措施和建议。
Solder-paste printing plays an important part in SMT production, and affects the quality of assemblies. The article introduces many factors of infecting quality in Solder-paste printing process and have analysed those reasons, present some corrective actions and advice at the same time.
出处
《现代表面贴装资讯》
2005年第4期11-14,共4页
Modern Surface Mounting Technology Information
