摘要
介绍了一种无氰亚硫酸盐镀金工艺的工艺流程、工艺配方、操作条件及镀液中各组分的作用。给出了镀液维护的方法及后处理工艺的配方。分析了镀金常见故障的原因,并给出了排除方法。
The technological process, technological formulation, operating conditions and function of each bath component were introduced. The maintenance methods of bath and the technological formulation of posttreatment were given. The reasons for usual failure were analysed, and the corresponding troubleshooting were presented.
出处
《电镀与涂饰》
CAS
CSCD
2005年第9期31-32,共2页
Electroplating & Finishing
关键词
无氰
镀金
亚硫酸钠
故障排除
non-cyanide
gold plating
sodium sulfite
troubleshooting