刚挠结合印制电路板的制造工艺和应用(英文)

The Manufacturing Process and Application of Rigid-flex PCB

自从1980’初期,刚挠结合板首次使用在高可靠性军事电子设备中以来,在高科技领域得到了广泛的应用,如今已成为印制板工业中的研究热点之一。本文综述了刚-挠结合板主要优点、制作工艺、现在所处的研究状态以及商业化应用。文章报道了我们的研究成果,并着重分析了制作工艺中的难点。

Since from 1980＇ s early, rigid- flex PCBs first used in High Reliability Military electronics. The rigid - flex PCBs have been used in many high tech fields for their excellent performances and becoming one of hot research topics in PCB industry. This paper introduces the main characteristics, the manufacturing process, our research and the applications of rigid -flex PCB. In this paper ,our study results are reported and several problems of .manufacturing process is also discussed in detail.