摘要
以低温界面热阻实验研究为基础,以氮化铝(AlN)和无氧铜(Cu)样品为对象,研究了温度和压力对陶瓷(AlN)和金属(Cu)之间的界面热阻的影响.应用最小二乘法和MATLAB软件工具,得到界面热阻和界面温度以及接触压力之间的关系,建立其数学模型和计算机仿真模型,从而可以预测在不同的界面温度和不同接触压力作用下AlN和Cu之间的界面热阻.界面热阻温度范围90～200 K,压力变化范围0.273～0.985 MPa,仿真结果与实验结果误差小于5%.这对低温与超导、超导材料及其应用技术有重要意义.
Based on the research on the cryogenic experiment of interface thermal resistance between AlN and Cu, the computer simulation of interface thermal resistance was described in this paper at the first time. By applying least square method and simulation software of MATLAB, the mathematical model and computer simulation model of interface thermal resistance with pressure and temperature can be made up so that the value of interface thermal resistance was predicted. The scope of temperature is from 90 K to 200 K, the pressure was changed from 0.273 MPa to 0.985 MPa, the error between simulation result and experiment result is no more than 5%. It is significance for the cryogenics, superconductor, superconducting materials and its application.
出处
《低温与特气》
CAS
2005年第4期13-15,共3页
Low Temperature and Specialty Gases
基金
国家自然科学基金资助项目(51076013)
国家863高技术研究发展计划(2002AA306331-4)
关键词
计算机仿真
界面热阻
最小二乘法
低温
computer simulation
interface thermal resistance
least square method
cryogenics
