摘要
分析比较了固体激光软钎焊系统和半导体激光软钎焊系统的优缺点,介绍了采用半导体激光器作为热源用于无铅软钎焊的工艺特点和钎焊机理、激光参数对软钎焊焊点质量的影响因素,以及半导体激光软钎焊技术的应用和发展趋势。
The advantage and disadvantage of solid laser soldering system and diode - laser soldering system were analyzed in this paper. Technological characteristics and soldering mechanism of lead - free soldering using diode - laser as heat source were introduced. Influences of laser parameters on soldered joint quality, and the application and development of diode - laser soldering were also discussed briefly.
出处
《焊接》
北大核心
2005年第8期40-44,共5页
Welding & Joining
