高强度、高导电铜合金及铜基复合材料研究进展

Progress in High-strength and High-conductivity Copper Alloys and Copper Base Composites

概述了高强度、高导电铜合金及铜基复合材料的研究现状,介绍了此类材料的强化机理、制备方法、组织、性能特点,指出:传统析出强化型铜合金具有较高的强度和导电性,且制备工艺较简单,适于用作各类电连接器件材料,今后此类材料应注重综合利用各种强化手段和多元合金化,以提高性能,降低成本;弥散强化铜(DSC)在高温应用领域有显著优势,但存在工艺复杂、性能不稳定等问题;形变铜基复合材料具有较前两者更为优异的性能,代表了高强度、高导电铜基导电材料的发展方向,但制备工艺复杂,应用受到限制。

The progress in high-strength and high-conductivity copper alloy and copper base composites were surveyed.The strengthening mechanism,preparation technology and microstructure and properties of the alloy were introduced.It was pointed out that conventional precipitated strengthening copper alloy possesses higher strength and conductivity and simple preparation technology suitable for manufacturing various electric connecting component,focusing on the comprehensive utilization of strengthening mechanisms and multi-element alloy in future to improve properties and lower cost.Although dispersed strengthening copper has remarkable advantages in elevated application,there exists the problem of complicated technology and un-stable properties.The deformation-processed copper-based composites with high performance can meet the requirements but it is necessary to simplify the process.