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MEVVA源强流Ti离子注入纯铜表面层的结构与性能研究 被引量:2

A STUDY ON THE STRUCTURE AND PROPERTY OF THE PURE COPPER SURFACE LAYERS IMPLANTED WITH MEVVA Ti ION SOURCE
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摘要 采用金属蒸气真空弧(MEVVA)离子源技术对强流Ti离子束注入到纯铜表面的结构和性能进行了系统的研究。材料表面层的机械性能测试表明:强流Ti离子注入纯铜后材料表面的硬度和耐磨性均有提高,相对于纯铜基体,5×1017cm-2注量注入可以使材料表面硬度提高2.3倍,使表面摩擦因数下降14%.注入层的X射线结构分析表明:金属离子注入后,在纯铜表面注入层中析出了合金相,合金相的析出是材料的表面硬度和耐磨性提高的主要因素. The structure and property of the pure copper surface layers implanted with MEVVA Ti ion source are systematically investigated, The measurement results of mechanical properties show that the hardness and abrasion resistance of copper surface implanted with Ti ions are modified. The surface hardness of the sample implanted with an ion dose of 5×10^17 cm^-2 is 3. 3 times as large as that of pure copper surface, and surface resistance coefficient is 86% of that for pure copper surface. The XRD diffraction analysis shows that alloy phases are formed in the ion implanting layers. This means that the main effects for the increase of the hardness and abrasion resistance of copper surface implanted with Ti ions are the formation of alloy phases in the ion implanted layers.
出处 《北京师范大学学报(自然科学版)》 CAS CSCD 北大核心 2005年第4期376-379,共4页 Journal of Beijing Normal University(Natural Science)
基金 国防科工委预研基金资助项目(51461070503QT38)
关键词 Ti离子注入 显微结构 机械性能 Ti ion implantation copper microstructure mechanical properties
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