基于热应力的高温超导薄膜界面热阻模型研究

Investigation on the mathematic model of thermal boundary resistance for thin-film high-T_c superconductors based on the peeling stress

依据基于热应力理论的高温超导薄膜材料界面热阻数学模型,对高温超导薄膜Er-Ba-Cu-O与其基体MgO界面热阻随热应力变化的模型进行参数辨识.应用MATLAB开发工具设计界面热阻仿真软件,对其变化规律进行仿真研究.结果表明:界面热阻实验与仿真温度范围为20～180K,模型误差小于10%,高温超导薄膜界面热阻随热流增加而减小,仿真结果与实验数据有较好的一致性.

Based on the peeling stress mathematic model of thermal boundary resistance between Er-Ba-Cu-O film on MgO substrates, the model parameter identifier was described in this paper. The relation of thermal boundary resistance with thermal flux was investigated by use of simulation software of thermal boundary resistance designed with the MATLAB development tool. In this study, the scope of experiment and simulation on thermal boundary resistance is between 20 K and 180 K, the value of thermal boundary resistance was decreased while the thermal flux was increased and the errors between model and experiment data was less than 10 %. It was showed that the simulation results are greatly in accordance with the experiment data.