摘要
无铅焊接与封装是对新一代电子产品的基本要求,SnAgCu系合金是最有可能替代SnPb焊料的无铅焊料。SnAgCu-Cu界面金属间化合物(intermetalliccomponents,IMC)的形成与生长对电子产品的性能和可靠性有重要影响。文中讨论SnAgCu-Cu界面IMC的形貌及组织演变,介绍SnAgCu-Cu界面IMC的形成、生长机理和表征方法,分析IMC对SnAgCu-Cu界面破坏行为的影响。
Pb-free soldering is a basic requirement for new generalion electrtonie packages. The Sn-Ag-Cu serials solders are widely recommended, by researches and electronie manutacturers, to be used as the substitutes of SnPb solder. However, the formation and growth of the intermetallic components （IMC） al the interface of SnAgCu solder and the Cu substrate are proven to exhibit a significant effect on the bounding strength and failure behavior of the joints. The morphological characteristics and the microstrueture evolution of the IMCs were presented, the mechanism and the characterization of the IMCs as well as their influence on interlace failure were also analvzed.
出处
《机械强度》
EI
CAS
CSCD
北大核心
2005年第5期666-671,共6页
Journal of Mechanical Strength
基金
国家自然科学基金(50475043)
北京市自然科学基金(2052006)
教育部博士点基金(20040005012)资助项目。~~
关键词
无铅焊料
金属间化合物(IMC)
断裂
表面组装
电子封装
Lead-free solder
Intermetallic compound （IMC）
Fracture
Surface mounting technology （SMT）
Electronic package
