摘要
试验确定粉状酚醛树脂竹大片刨花板的较佳制板工艺条件为:板材密度压缩比1:1.4(密度为0.86 g/cm3),施胶量3.5%,刨花含水率12%,热压温度(165±5)℃,闭合速度12.5 mm/s,热压时间1.35～1.45 min/mm板厚,压力8.75 MPa.按以上工艺条件制备的板材性能达到或超过加拿大CAN 3-O437.0-M85相关要求.
A series of experiments on determination of manufacturing technology for bamboo-based waferboard bonded with powdered phenol-formaldehyde （PF） resin were conducted by the authors. The optimum parameters obtained though the experiments were as follows： mat compression ratio at 1 ： 1.4 （board density 0. 86 g/cm^3）, glue consumption of 3. 5%, wafer moisture content 12%after resin application, and hot pressing at （165±5）℃ and 8. 75 MPa, with closing speed at 12.5 mm/s, and pressing time at 1.35-1.45 min/mm. Waferboard made under the above conditions have excellent properties equal or even superior to the requirements of Canadian Standard CAN 3-O437.0-M85.
出处
《木材工业》
北大核心
2005年第5期10-12,共3页
China Wood Industry
关键词
竹大片刨花板
粉状酚醛树脂
含水率
施胶量
bamboo-based waferboard
powdered phenol-formaldehyde resin
moisture content
adhesive consumption
