摘要
对现有的几种硅片键合强度测试方法进行总结,在裂纹传播扩散法测试机理分析的基础上,提出了测试系统需要得到的参数和功能.采用模块化设计思想,对测试系统中的精密定位、显微视觉、红外测试和控制系统等关键技术分别研究,最后将单元技术集成,研制成功测试系统样机.通过对多个键合硅片强度测试对比实验,证明了该系统的有效性.
Some measurement methods of wafer bonding strength were summarized. The principle of crack-opening method was analyzed and the system parameters and function were presented. A design idea was used to develope the testing system. Some key technique modules including precision positioning, micro-vision, IR measurement and control system are studied respectively. A wafer bonding strength measurement system are designed based on integrating all the modules. Finally, the feasibility of the system is tested by some contrast experiments with different bonding samples.
出处
《测试技术学报》
EI
2005年第2期137-140,共4页
Journal of Test and Measurement Technology
基金
国家863计划资助项目(2004AA404044)
关键词
键合强度
键合
表面能
裂纹传播扩散
测试
bond strength
wafer bonding
surface energy
crack-opening
test
