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微加工多晶硅薄膜热导率T型测试结构的设计与模拟 被引量：1

Design and Simulation of T-type Test Structures for Determination of Thermal Conductivity of Micromachined Polysilicon Thin Films
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摘要 提出了一种表面加工多晶硅薄膜热导率的T型测试结构。给出了热学模型和测试方法,并利用ANSYSTM软件进行模拟分析,验证了该测试方法是适用的。该测试方法能够实现多晶硅薄膜热导率的在线测试。 It presents a new test structure for measuring thermal conductivity of polysilicon thin films fabricated by the surface micromachining process. The measurement method and thermal modeling are given, and the relults are confirmed by ANSYS^TM. The test structure can meet the requirements of on-line determination for the thermal conductivity of polysilicon thin films.
作者 许高斌 黄庆安 李伟华
机构地区 东南大学MEMS教育部重点实验室
出处 《仪器仪表学报》 EI CAS CSCD 北大核心 2005年第9期917-922,944,共7页 Chinese Journal of Scientific Instrument
基金 国家"863"计划课题(2003AA404010)资助项目。
关键词 热导率 微加工 测试结构 多晶硅薄膜 Thermal conductivity Micromachining Test structure Polysilicon thin film
分类号 TN402 [电子电信—微电子学与固体电子学] TN405 [电子电信—微电子学与固体电子学]
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参考文献6

  • 1McConnell D. , Uma S.. Thermal conductivity of doped polysilicon layers. Journal of Microelectro-mechanical Systems, 2001,10(3) : 360-369.
  • 2Jansen E. , Obermeier E.. Thermal conductivity measurements on thin films based on micromechanical devices. J. Micromech. Microeng., 1996,6(3): 118-121.
  • 3Arx M. , Paul O. , Baltes H.. Process dependent thin film thermal conductivitis for thermal CMOS MEMS.Journal of Microelectromechanical Systems, 2000, 3:136-144.
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共引文献4

同被引文献22

  • 1Obermerier E,Kopystynsk P.Polysilicon as a material for microsensor applications.Sensors and Actuators A,1992,(30):149～155
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  • 10Irace A,Sarro P M.Measurement of thermal conductivity and diffusivity of single and multiplayer membranes.Sensors and Actuators A,1999,76:323～328

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仪器仪表学报
2005年 第9期

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