摘要
根据有限元工具ANSYS的分析结果,设计了一种半导体压阻式压力传感器——绝缘体上硅(SOI)压力传感器,并完成了制作.测试表明,除具有良好的静态特性之外,与同类压力传感器相比,SOI压力传感器的工作温区宽,最高工作温度可达220℃;稳定性高,30d内的零点漂移小于0.2%;温度特性好,灵敏度温度系数约为-5.1×10-4/℃.此外传感器的结构简单,采用半导体集成电路平面工艺结合微机械加工技术制作,易于实现批量生产,有广阔的应用前景.
According to the results of finite-element analysis with ANSYS, a piezoresistive pressure sensor based on silicon on insulator (SO1) was designed. Compared with other semiconductor piezoresistive pressure sensors, SO1 piezoresistive pressure sensor has a broader operating temperature range,as well as good static performance. Its highest operating temperature can reach 220℃. Moreover, the offset drift in 30 days and the temperature coefficient of sensitivity ( both referred to full scale output) are about 0.2 % and - 5. 1 × 10^ -4/℃ , respectively. The sensor has simple structures fabricated with integrated circuit (IC) planar processes and micromachining technology, and so batch productions can be easily realized.
出处
《天津大学学报》
EI
CAS
CSCD
北大核心
2005年第10期901-903,共3页
Journal of Tianjin University(Science and Technology)
基金
天津市自然科学基金资助项目(033600811).
关键词
绝缘体上硅
高温压力传感器
微机械加工
silicon on insulator
high-temperature pressure sensor
micromachining