倒装芯片中凸点与凸点下金属层反应的研究现状

Current Research on the Reaction between Solder Bump and under Bump Metallurgy Systems in Flip Chip

随着当代电子封装技术的飞速发展以及无铅化潮流的兴起,倒装芯片中凸点(Solder Bump)与凸点下金属层(UBM)之间的反应的研究成为当前研究的热点。综述了 UBM 与凸点反应研究的最新进展,总结了钎焊过程中的界面反应和元素扩散行为,分析了界面金属间化合物层(IMC)在长时间回流焊接过程中剥落的原因,进一步指出了凸点与 UBM 反应研究的趋势。

With the rapid development of electronic packaging technology and the rise of the lead free trend, the research of reaction between solder bump and under bump metallurgy （UBM） becomes a hot topic in flip chip technology. This paper reviews the newest progress of the reaction between the UBM and solder bump, summarizes the interface reaction and the diffusion behavior of the elements during the reflow process and analyses the reason that causes the spalling of interface intermetallic compound （IMC） layer during the longer fellow process. Further more, this paper points out the trend of the research on the reaction between solder bump and UBM.