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一种计算大功率LED光源模块器件结温的方法 被引量:6

A method for calculating junction temperature of high-power LEDs of light source modules
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摘要 研究了大功率LED光源模块各器件之间热传导的相互影响,建立了一种基于热阻矩阵的LED光源模块器件结温计算公式,然后以一个由5只1W大功率器件组成的光源模块为例,演示如何通过测量器件的正向工作电压计算热阻矩阵,进而计算各器件的结温,并与现有方法计算值以及红外测温仪实际测量值进行了比较,结果表明:本方法比现有计算方法更为准确,可以用来预测LED光源的使用寿命和系统可靠性. The influence of heat exchange between high-power LEDs in a light source module is studied, The formulation of PN junction temperature of multiple high-power LEDs is set up based on thermal resistance matrix. Then the calculation method of thermal resistance matrix by measuring forward voltages of LEDs is described. Finally, junction temperature of each high-power LED is calculated by taking a light source module of five 1 watt LEDs as an example. The result indicates that the arithmetic is more accurate than the former one in junction temperature calculation of high-power LEDs of light source modules. It could be applied to the evaluation of lifetime and system reliability of light source modules in engineering applications.
出处 《高技术通讯》 CAS CSCD 北大核心 2005年第9期49-52,共4页 Chinese High Technology Letters
基金 国家高技术研究发展计划(863计划)
关键词 热阻矩阵 PN结温 LED光源模块 大功率LED LED光源 器件组成 电压计算 结温 功率 红外测温仪 系统可靠性 相互影响 thermal resistance matrix, PN junction temperature, LED light source module, high-power LEDs
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  • 1Application Brief AB23. Thermal design considerations for Luxeon V power light sources, http://www, lunfileds, com:Lumileds Lighting, 2003.
  • 2Arik M, Petroski J, Weaver S. Thermal challenges in the future generation solid state lighting applications: light emitting diodes. In: Proe. IEEE Intersociety Conf. Thermal Phenomena, San Diego, CA, 2002. 113.
  • 3Gu Y M, Narendran N. 2004. A non-contact method for detemaining junction temperature of phosphor-converted white LEDs. In: Proceedings of SPIE 5187, Third International Conference on Solid State Lighting. San Diego, CA, 2003. 107.
  • 4Application Brief AB05. Thermal design using hrxeon power light sources, http://www, lunfileds, com: Lunfileds Lighting,2003.
  • 5Sofia J W. Electrical thermal resistance measurements for hybrids and multi-chips packages, http://www, analysistech.corn: Analysis Tech, 2001.
  • 6Q/GO01-2003.发光二极管测试方法行业标准.[S].中国光学光电子行业协会光电器件分会,2003..

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