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带有MU连接器接口的40Gb/s光接收模块封装技术

Packaging Technology for 40Gb/s Optical Receiver Module with an MU-Connector Interface
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摘要 本文介绍了一种带有MU连接器接口的小型化40Gb/s光接收模块封装技术。详细叙述了光接收模块设计中的三个关键技术。实现了阻抗匹配最佳化,改进了电特性。 Packaging technology for a compact 40Gb/s optical receiver module with an MU-connector interface is described. Three key technologies in design of optical receiver module are particularly described. Impedance matching optimization is realized and electronic characteristics are improved.
出处 《电子与封装》 2005年第9期17-19,33,共4页 Electronics & Packaging
关键词 光接收模块 焊凸 共平面波导(CPW) 倒装芯片结构 M U连接器 封装 Optical receiver Solder bump CPW Flip-chip structure MU- connector Packaging
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参考文献3

  • 1M.Hirose,N.Ishihara,Y Akazawa at cl.An ultracompact, 2 - cc-size, low-power 2.5Gb/s optical receiver module incorporating an MU receptacle[].Journal of Lightwave Technology.1999
  • 2noboru Iwasaki,Mitsuaki Yanagibashi,Hideki Tsunetsugu at cl.Packaging Technology for 40-Gb/s Optical Receiver Module with an MU-Connector Interface[].IEEE TRANSACTIONS ON ADVANCED PACKAGING.2001
  • 3F.Ishitsuka,N. Iwasaki,M.Hirose at cl.A compact MU-interface 2.5Gb/s optical transmitter module with LD driver IC in L shaped wiring substrate[].IEEE TRANSACTIONS ON ADVANCED PACKAGING.1999

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